Arias Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 8″ wafers FOM-Name:Wet Bench RCALocation:CMNT, Room 001 Tool manager: Birger Berghoff Instruction video: Open video Tool description:
Author: Joachim Knoch
Wet Bench Resist and HMDS Coating
Arias Modus Operandi:User-modeContamination category: A, B, C if appropriate handle wafer and chucks are usedSample-size:Pieces … 6″ wafer FOM-Name:Wet Bench Resist CoatingLocation:CMNT, Room 001 Tool manager: Birger Berghoff Instruction video: Open video Tool description:
HF Vapor Phase Etcher
Idonus Sarl, VPE-150 Modus Operandi:User-modeContamination category:A, BSample-size:Pieces … 4″ FOM-Name:HF Vapor Phase EtcherLocation:CMNT, Room 001 Tool manager: Birger Berghoff Instruction video: Tool description:
DRIE (Cobra)
Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 4″ wafers,8″ wafers possible with small modifications FOM-Name: ICP-DRIE EtcherLocation: CMNT, Room 006 Tool manager: Birger Berghoff Instruction video: Open video Tool description:
Spectroscopic Ellipsometer
Accurion, nanofilm_ep4se Modus Operandi:User-modeContamination category: A,B,C if appropriate carrier wafers are usedSample-size:Pieces … 4″ wafer FOM-Name:EllipsometerLocation:CMNT, Room 001 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Mapping is possible (100 mm x 100 mm), lateral resolution: 1 μm, spectral range: 360…950 nm Standard Operation Procedure EP4v2.3, Mapping EP4v1.1, Short Manual
MA_BA6
SÜSS MicroTec, MA/BA6 Modus Operandi:User-modeContamination category: A,B,C if appropriate chuck and masks are usedSample-size:Pieces … 6″ wafer FOM-Name:Optical Lithography (MABA6)Location:CMNT, Room 009 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Top- and back-side alignment
Profilometer (DektakXT)
Bruker, DektakXT Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 4″ wafer FOM-Name:ProfilometerLocation:CMNT, Room 001 Tool manager: Birger Berghoff Instruction video: Open video1, open video2 Tool description:
Plasma Processes
Plasma processes play a very important role for a number of microfabrication techniques such as reactive ion etching or sputter deposition. At CMNT we operate a broad range of tools that rely on plasma processes such as inductively coupled plasma reactive ion etching, metal and dielectric sputter deposition, oxygen plasma ashing as well as remote […]
Microsystems
Apart from microfabrication, CMNT also offers a broad range of different tools for chip packaging such as reflow ovens, thick and thin wire bonders as well as flip-chip bonders. Packaging is particularly important technique to assemble e.g. micro- and nanoelectromechanical sensor chips and their periphery into full microsystems.