SÜSS MicroTec, MA8 Gen3 Modus Operandi:Service-ModeContamination category:BSample-size:2″ – 8″ wafers FOM-Name:- AMO – SCIL UV NanoimprintLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: SCIL 2″-8″ UV-Nanoimprint Lithography
Category: Available Processing Tools
Soft UV Nanoimprint Lithography Prototype System
EVG, 620 Modus Operandi:Service-ModeContamination category:BSample-size:4″- 6″ flexible template size FOM-Name:- AMO – Soft UV NanoimprintLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Soft UV Nanoimprint prototype
Interference Lithography System
Self-made Modus Operandi:Service-ModeContamination category:BSample-size:4″, 6″, 8″ and every rectangular shape within FOM-Name:- AMO – Interference Lithography SystemLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 180 nm – 2.5 μm pitch; stitching free gratings
Automatic Resist Coater and Developer
EVG, 150 Modus Operandi:Service-ModeContamination category:BSample-size:4″ – 8″ wafers FOM-Name:- AMO – Automatic Resist Coater and DeveloperLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 4″- 8″ automatic resist coater and developer; AZ MiR701, Primer, AZ5214E
Photolithography System (Stepper)
Canon, FPA 3000 i5+ Modus Operandi:Service-ModeContamination category:BSample-size:only 6″ wafers; no samples FOM-Name:- AMO – StepperLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 6″ i-line Stepper with 0.5 μm resolution
Photolithography System (Mask Aligner)
EVG, 420 Modus Operandi:Service-ModeContamination category:CSample-size:from samples of 10×10 mm² up to 6″ wafers FOM-Name:- AMO – Mask Aligner (EVG 420)Location:AMO Tool manager: AMO Instruction video: Not available Tool description: 6″ semi-automatic mask aligner; 2 µm resolution
Electron-Beam Lithography System
Vistec, EBPG 5200 Modus Operandi:Service-ModeContamination category:B and C (dedicated holder)Sample-size:from samples of 10×10 mm² up to 8″ wafers FOM-Name:- AMO – E-Beam Litho (Vistec EBPG 5200)Location:AMO Tool manager: AMO Instruction video: Not available Tool description: E-Beam lithography tool; 50/100 kV; sub 10 nm resolution
RIE (RIE-51)
MRC, RIE-51 Modus Operandi:User-modeContamination category: A, B, CSample-size:Pieces … 4″ FOM-Name:RIE 51Location:WSH, Room 24B131 Tool manager: Birger Berghoff Instruction video: Open video Tool description: SF6, CHF3, O2 and BCl3 based etching
ICP-RIE (Fluorian)
SENTECH, ICP-RIE SI 500 Modus Operandi: …Contamination category: CSample-size: Pieces … 4″ FOM-Name:ICP-RIE (Fluorian)Location:CMNT, Room 004 Tool manager: Jan Gruis Instruction video: Open video Tool description: SENTECH ICP-RIE SI500 Flourine-based process gases
Dicing Saw (DISCO DAD321)
DISCO, DAD321 Modus Operandi:Service-modeContamination category: A, BSample-size:Pieces … 4″ FOM-Name: – IHT – Dicing Saw Location: WSH, Room 24B108 Tool manager: Birger Berghoff Instruction video: Open video Tool description: DISCO, DAD321 Dicing saw for wafers up to 150 mm Materials: silicon, quartz, sapphire