DRIE (Cobra)

Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 4″ wafers,8″ wafers possible with small modifications FOM-Name: ICP-DRIE EtcherLocation: CMNT, Room 006 Tool manager: Birger Berghoff Instruction video: Open video Tool description: 

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MA4

SÜSS MicroTec, MA4 Modus Operandi:User-modeContamination category: A,B,C if appropriate chucks and masks are usedSample-size:Pieces … 4″ FOM-Name:– IHT – Optical Lithography (MA4)Location: WSH, Room 24B103 Tool manager: Birger Berghoff Instruction video: Open video Tool description: 

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MA_BA6

SÜSS MicroTec, MA/BA6 Modus Operandi:User-modeContamination category: A,B,C if appropriate chuck and masks are usedSample-size:Pieces … 6″ wafer FOM-Name:Optical Lithography (MABA6)Location:CMNT, Room 009 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Top- and back-side alignment

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