Oxford Instruments, PlasmaPro 100 Cobra Modus Operandi: User-mode Contamination category: A, B Sample-size: Pieces … 6″ wafers FOM-Name: ALE for Si-based Materials (Oxford Instruments, PlasmaPro100) Location: CMNT, Room 007 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Atomic-layer etching system for Si-based Materials. Available etching processes: Si, SiO2. Available gases: SF6, CH4, CHF3, O2, […]
Category: Dry Etching
Reactive-Ion Etching System
Oxford Instruments, RIE 80 Modus Operandi:User-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- RIE (RIE 80)Location:ZMNT, Room 006 Tool manager: Jochen HeissInstruction video: Not availableTool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar
Reactive-Ion Etching System
Tegal, 901 Modus Operandi:User-ModeContamination category:CSample-size:100 mm Wafer FOM-Name:- RIE (Tegal 901)Location:ZMNT, Room 006 Tool manager: Jochen HeissInstruction video: Not availableTool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar
Inductively-Coupled Plasma Reactive Ion Etching System
Oxford Instruments, PlasmaLab System 100 Modus Operandi:Service-ModeContamination category:Chamber 1: AChamber 2: BSample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name:- AMO – RIE1Location:AMO Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, […]
RIE (RIE-51)
MRC, RIE-51 Modus Operandi:User-modeContamination category: A, B, CSample-size:Pieces … 4″ FOM-Name:RIE 51Location:WSH, Room 24B131 Tool manager: Birger Berghoff Instruction video: Open video Tool description: SF6, CHF3, O2 and BCl3 based etching
ICP-RIE (Fluorian)
SENTECH, ICP-RIE SI 500 Modus Operandi: …Contamination category: CSample-size: Pieces … 4″ FOM-Name:ICP-RIE (Fluorian)Location:CMNT, Room 004 Tool manager: Jan Gruis Instruction video: Open video Tool description: SENTECH ICP-RIE SI500 Flourine-based process gases
Plasma Asher (PP35)
Alpha Plasma, PP35 Modus Operandi:User-modeContamination category: CSample-size:Pieces … 4″ FOM-Name:- Physik – Plasma AsherLocation:Physikzentrum, Room 28A313 Tool manager: Lars Schreiber Instruction video: Open video Tool description: Alpha Plasma, PP35
Plasma Asher (Tegal, 915)
Tegal, 915 Modus Operandi:User-modeContamination category: B,C (B if appropriate handling wafer is used)Sample-size:Pieces … 6″ wafers FOM-Name:N.N.Location:CMNT, Room 009 Tool manager: Jochen Heiss Instruction video: Open video Tool description: Tegal, 915
Plasma Asher/SF6 Plasma Etcher
Oxford Instruments, Plasmalab PRS 90 Modus Operandi:User-modeContamination category:B,C if appriate handle wafers are usedSample-size:Pieces … 6″ wafers FOM-Name:– IHT – Plasma AsherLocation:WSH, Room 24B132 Tool manager: Birger Berghoff Instruction video: Open video Tool description:
DRIE (Cobra)
Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System Modus Operandi:User-modeContamination category: A, BSample-size:Pieces … 4″ wafers,8″ wafers possible with small modifications FOM-Name: ICP-DRIE EtcherLocation: CMNT, Room 006 Tool manager: Birger Berghoff Instruction video: Open video Tool description: