Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 25 wafers per run; 9 samples (max. 2×2 cm) FOM-Name:- AMO – LPCVD-LTOLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: LTO (low temp. SiO2); 425°C; SiH4 and O2 process; up to 500 nm
Category: Chemical Vapor Deposition
Low Pressure Chemical Vapour Deposition Furnace for Polycrystalline Silicon
Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 25 wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – LPCVD-PolyLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Polysilicon; 620°C; SiH4 process; up to 500 nm
PECVD (Petzi)
Oxford Instruments, PlasmaLab 80 Plus Modus Operandi: …Contamination category: CSample-size:Pieces … 4″ FOM-Name:PECVD (Petzi)Location:CMNT, Room 004 Tool manager: Jan Gruis Instruction video: Open video Tool description: Oxford Instruments, PlasmaLab 80 Plus Parallel-plate PECVD Process gases: SiH4, O2, NH3
Clustertool (ALD+ICP-CVD)
Oxford Instruments, PlasmalabSystem 100 Modus Operandi:User-modeContamination category: BSample-size:Pieces … 6″ wafers,8″ wafer possible with small modifications FOM-Name:– IHT – Cluster-Tool (ALD and ICP-CVD)Location:WSH, Room 24B101 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Oxford Instruments, PlasmalabSystem 100