Leybold, A700QE Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Box Coater Leybold A700QE (Electron-Beam)Location:ZMNT, Room 007 Tool manager: Jochen HeissInstruction video: Not availableTool description:Materials: Au, Cr, Ti, Cu, Al, on demand
Category: Metallization
Sputtering System
Nordiko, NS 2550 Duisburg Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Nordiko (Duisburg)Location:ZMNT, Room 007 Tool manager: Jochen HeissInstruction video: Not availableTool description:Targets: Ti, Pl, Iridium, on demand
Sputtering System
Nordiko, NS 2550 Berlin Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Nordiko (Berlin)Location:ZMNT, Room 007 Tool manager: Jochen Heiss Instruction video: Not available Tool description: Targets: Ti, Au, changing, on demand
Atomic Layer Deposition Tool
Oxford Instruments, FlexAL Modus Operandi:Service-ModeContamination category:CSample-size:up to 8″ wafers; 8″ dummy wafer for samples FOM-Name:- AMO – ALDLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Materials: AlN, Al2O3, TaN, TiN; process gases: N2, H2, O2, SF6, Ar, NH3, H2O; Wafer stage temperature up to 400°C
Electron-Beam and Thermal Evaporation System
Pfeiffer Vacuume, Classic 580 Modus Operandi:Service-ModeContamination category:CSample-size:4″-, 5″- and 6″-wafers; sample size up to 6″ FOM-Name:- AMO – EvaporatorLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 6″ e-beam and resistive evaporator; Materials: Al, Cr, SiO2, Ti, Ta2O5, etc.; process gases: N2, O2
E-Beam and Thermal Evaporator with Sputter Target
CREAVAC Modus Operandi:User-modeContamination category: CSample-size:Pieces … 4″ FOM-Name:E-Beam and Thermal EvaporatorLocation:CMNT, Room 002 Tool manager: Natalie BrugerInstruction video: Open videoTool description: 7 x 7 cm3 e-beam evaporator crucibles (8 keV), 2 thermal evaporators (2 kW), 1 DC sputter source,Ar milling, base pressure: 5 x 10-8 mbar, load-lock, fully rotatable, tiltable (+75°), heatable 200 °C, water-cooled, variable working distance: 20…70 cm
Clustertool (ALD+ICP-CVD)
Oxford Instruments, PlasmalabSystem 100 Modus Operandi:User-modeContamination category: BSample-size:Pieces … 6″ wafers,8″ wafer possible with small modifications FOM-Name:– IHT – Cluster-Tool (ALD and ICP-CVD)Location:WSH, Room 24B101 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Oxford Instruments, PlasmalabSystem 100