All Processing Tools

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  • Electron-Beam Lithography System

    RAITH, eLINE

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B, C
    • Sample-size:
      Pieces ... 4″
    E-Beam Lithography RAITH E-Line

    FOM-Name and Location

    • FOM-Name:
      - Physik - E-Beam Litho (Raith eLINE)
    • Location:
      Physikzentrum, Room 28A315

    Resources

    • Tool manager:
      Lars Schreiber
    • Instruction video:
      Open video
    • Tool description:
      Raith, eLINE
    Continue reading →

  • Electron-Beam and Thermal Evaporation System

    Pfeiffer Vacuume, Classic 580

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      4"-, 5"- and 6"-wafers; sample size up to 6"

    FOM-Name and Location

    • FOM-Name:
      - AMO - Evaporator
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6″ e-beam and resistive evaporator; Materials: Al, Cr, SiO2, Ti, Ta2O5, etc.; process gases: N2, O2
    Continue reading →

  • Electron-Beam Evaporation System

    Leybold, A700QE

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Box Coater Leybold A700QE (Electron-Beam)
    • Location:
      ZMNT, Room 007

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Materials: Au, Cr, Ti, Cu, Al, on demand
    Continue reading →

  • Electron Beam Lithography System

    Raith,  RAITH150 Two

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chucks are used
    • Sample-size:
      Pieces ... 6″ wafers
    Electron Beam Lithography, RAITH 150/Two

    FOM-Name and Location

    • FOM-Name:
      – IHT – E-Beam Litho (RAITH150 Two)
    • Location:
      WSH, Room 24B102

    Resources

    Continue reading →

  • Electron-Beam Lithography System

    Vistec, EBPG 5200

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B and C (dedicated holder)
    • Sample-size:
      from samples of 10×10 mm² up to 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - E-Beam Litho (Vistec EBPG 5200)
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      E-Beam lithography tool; 50/100 kV; sub 10 nm resolution
    Continue reading →

  • HF Vapor Phase Etcher

    Idonus Sarl, VPE-150

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category:
      A, B
    • Sample-size:
      Pieces ... 4″
    Idonus Vapor HF

    FOM-Name and Location

    Resources

    Continue reading →

  • Inductively Coupled Plasma Reactive-Ion Etcher

    SENTECH, ICP-RIE SI 500

    Usage

    • Modus Operandi:
      ...
    • Contamination category: C
    • Sample-size:
      Pieces ... 4″
    ICP-RIE Reactive Ion Etching

    FOM-Name and Location

    • FOM-Name:
      ICP-RIE (Fluorian)
    • Location:
      CMNT, Room 004

    Resources

    • Tool manager:
      Jan Gruis
    • Instruction video:
      Open video
    • Tool description:
      SENTECH ICP-RIE SI500
      Flourine-based process gases
    Continue reading →

  • Inductively-Coupled Plasma Reactive Ion Etching System

    Oxford Instruments, PlasmaLab System 100

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      Chamber 1: A
      Chamber 2: B
    • Sample-size:
      up to 6″ substrates; 6" dummy wafer for samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - RIE1
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, Ar, He
    Continue reading →

  • Interference Lithography System

    Self-made

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      4", 6", 8" and every rectangular shape within

    FOM-Name and Location

    • FOM-Name:
      - AMO - Interference Lithography System
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      180 nm – 2.5 μm pitch; stitching free gratings
    Continue reading →

  • Internal Quantum Efficiency Measurement System

    PV Tools, IQE-SCAN

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B, C
    • Sample-size:
      Pieces and 6″ solar cells
    PVTools IQE Measurements

    FOM-Name and Location

    • FOM-Name:
      - IHT - IQE Measurements
    • Location:
      WSH, Room 24B116

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      PV Tools, IQE-SCAN
    Continue reading →


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