Inductively Coupled Plasma Deep Reactive-Ion Etching System
Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System
Usage
- Modus Operandi:
User-mode - Contamination category: A, B
- Sample-size:
Pieces ... 4″ wafers,
8″ wafers possible with small modifications
FOM-Name and Location
- FOM-Name: ICP-DRIE Etcher
- Location: CMNT, Room 006
Resources
- Tool manager: Birger Berghoff
- Instruction video: Open video
- Tool description: