Clustertool (ALD+ICP-CVD)

Joachim Knoch Atomic Layer Deposition, Available Processing Tools, Chemical Vapor Deposition, Metallization

Cluster Tool for Atomic Layer Deposition and Inductively Coupled Plasma Chemical Vapor Deposition

Oxford Instruments, PlasmalabSystem 100

Usage

  • Modus Operandi:
    User-mode
  • Contamination category: B
  • Sample-size:
    Pieces ... 6″ wafers,
    8" wafer possible with small modifications
Oxford Clustertool, ALD – ICP-PECVD

FOM-Name and Location

  • FOM-Name:
    – IHT – Cluster-Tool (ALD and ICP-CVD)
  • Location:
    WSH, Room 24B101

Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description:
    Oxford Instruments, PlasmalabSystem 100