Wafer Bonder
SÜSS MicroTec, SB6e
Usage
- Modus Operandi:
User-mode - Contamination category: B,C if appropriate handling tools are used
- Sample-size:
6″ wafers
FOM-Name and Location
- FOM-Name:
N.N. - Location:
CMNT, Room 006
Resources
- Tool manager:
Jochen Heiss - Instruction video:
Open video - Tool description:
SÜSS MicroTec, SB6e