All Processing Tools

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  • Annealer

    Self-built

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: C
    • Sample-size:
      Pieces
    Physik Annealer

    FOM-Name and Location

    • FOM-Name:
      - Physik - Annealer
    • Location:
      Physikzentrum, Room 28A313

    Resources

    • Tool manager:
      Natalie Bruger
    • Instruction video:
      Open video
    • Tool description:
             Self-built annealer
    Continue reading →

  • Atomic Layer Deposition Tool

    Oxford Instruments, FlexAL

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      up to 8" wafers; 8" dummy wafer for samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - ALD
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      Materials: AlN, Al2O3, TaN, TiN; process gases: N2, H2, O2, SF6, Ar, NH3, H2O; Wafer stage temperature up to 400°C
    Continue reading →

  • Atomic-Layer Etching System

    Oxford Instruments, PlasmaPro 100 Cobra

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B
    • Sample-size:
      Pieces ... 6″ wafers
    Atomic-Layer Etching System

    FOM-Name and Location

    • FOM-Name: ALE for Si-based Materials (Oxford Instruments, PlasmaPro100)
    • Location: CMNT, Room 007

    Resources

    • Tool manager: Birger Berghoff
    • Instruction video: Open video
    • Tool description: Atomic-layer etching system for Si-based Materials. Available etching processes: Si, SiO2. Available gases: SF6, CH4, CHF3, O2, H2, Cl2,
    Continue reading →

  • Automatic Resist Coater and Developer

    EVG, 150

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      4" - 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Automatic Resist Coater and Developer
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      4″- 8″ automatic resist coater and developer; AZ MiR701, Primer, AZ5214E
    Continue reading →

  • Cluster Tool for Atomic Layer Deposition and Inductively Coupled Plasma Chemical Vapor Deposition

    Oxford Instruments, PlasmalabSystem 100

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B
    • Sample-size:
      Pieces ... 6″ wafers,
      8" wafer possible with small modifications
    Oxford Clustertool, ALD – ICP-PECVD

    FOM-Name and Location

    • FOM-Name:
      – IHT – Cluster-Tool (ALD and ICP-CVD)
    • Location:
      WSH, Room 24B101

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      Oxford Instruments, PlasmalabSystem 100
    Continue reading →

  • Chemical-Mechanical Polisher

    STRASBAUGH, 6EC

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B (C with dedicated polishing pads)
    • Sample-size:
      4″
    Chemical Mechanical Polishing

    FOM-Name and Location

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      STRASBAUGH, 6EC
    Continue reading →

  • Dicing Saw

    DISCO, DAD321

    Usage

    • Modus Operandi:
      Service-mode
    • Contamination category: A, B
    • Sample-size:
      Pieces ... 4″
    Dicing Saw - Silicon

    FOM-Name and Location

    • FOM-Name:
      - IHT - Dicing Saw
    • Location:
      WSH, Room 24B108

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
      DISCO, DAD321
      Dicing saw for wafers up to 150 mm
      Materials: silicon, quartz, sapphire
    Continue reading →

  • Inductively Coupled Plasma Deep Reactive-Ion Etching System

    Oxford Instruments, PlasmaPro 100 Cobra ICP Etch System

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B
    • Sample-size:
      Pieces ... 4″ wafers,
      8″ wafers possible with small modifications
    Oxford Deep Reactive Ion Etcher

    FOM-Name and Location

    Resources

    • Tool manager: Birger Berghoff
    • Instruction video: Open video
    • Tool description: 
    Continue reading →

  • Dry Oxidation Furnace

    Centrotherm

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      A
    • Sample-size:
      up to 200x6" or up to 50x8" wafers per run; 15x15 cm tray for samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - Dry Oxidation Furnace
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      3″ – 8″ Centrotherm furnace; dry oxidation up to 300 nm
    Continue reading →

  • Electron-Beam Evaporation, Thermal Evaporation and Sputtering System

    CREAVAC

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: C
    • Sample-size:
      Pieces ... 4″
    E-Beam Evaporator

    FOM-Name and Location

    • FOM-Name:
      E-Beam and Thermal Evaporator
    • Location:
      CMNT, Room 002

    Resources

    • Tool manager:
      Natalie Bruger
    • Instruction video:
      Open video
    • Tool description:
      7 x 7 cm3 e-beam evaporator crucibles (8 keV),
      2 thermal evaporators (2 kW),
      1 DC sputter source,
      Ar milling,
      base pressure: 5 x 10-8 mbar,
      load-lock,
      fully rotatable, tiltable (+75°), heatable 200 °C, water-cooled,
      variable working distance: 20...70 cm
    Continue reading →


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