Inductively-Coupled Plasma Reactive Ion Etching System
Oxford Instruments, PlasmaLab System 100
Usage
- Modus Operandi:
Service-Mode - Contamination category:
Chamber 1: A
Chamber 2: B - Sample-size:
up to 6″ substrates; 6" dummy wafer for samples
FOM-Name and Location
- FOM-Name:
- AMO - RIE1 - Location:
AMO
Resources
- Tool manager:
AMO - Instruction video:
Not available - Tool description:
ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, Ar, He