Wafer Bonding

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• Wafer Bonder

  SÜSS MicroTec, SB6e

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: B,C if appropriate handling tools are used
  • Sample-size:
    6″ wafers

  

  FOM-Name and Location

  • FOM-Name:
    N.N.
  • Location:
    CMNT, Room 006

  Resources

  • Tool manager:
    Jochen Heiss
  • Instruction video:
    Open video
  • Tool description:
    SÜSS MicroTec, SB6e
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• Photolithography System (Mask Aligner / Bond Aligner)

  SÜSS MicroTec, MA/BA6

  Usage

  • Modus Operandi:
    User-mode
  • Contamination category: A,B,C if appropriate chuck and masks are used
  • Sample-size:
    Pieces ... 6″ wafer

  

  FOM-Name and Location

  • FOM-Name:
    Optical Lithography (MABA6)
  • Location:
    CMNT, Room 009

  Resources

  • Tool manager:
    Birger Berghoff
  • Instruction video:
    Open video
  • Tool description:
    Top- and back-side alignment
  Continue reading →

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